FMXMC3S2120FFC-20.000000M-CM,5032mm,FMXMC3S2系列,FMI貼片晶體,美國FMI晶振,陶瓷晶振,20MHZ輕薄型晶振,無源SMD晶體,5032mm兩腳貼片晶體,無源晶振,貼片諧振器,尺寸5.0x3.2mm,頻率20MHZ,工作溫度-40~+85°C,無鉛環(huán)保晶振,耐高溫晶振,高可靠晶振,高性能晶振,低損耗晶振,移動設(shè)備晶振,數(shù)字視頻晶振,測試設(shè)備晶振,蜂窩電話晶振,電子設(shè)備晶振.
FMXMC3S2120FFC-20.000000M-CM,5032mm,FMXMC3S2系列,FMI貼片晶體特點(diǎn):
表面貼裝陶瓷組件。
Micro 5x3.2,2片/超薄SMD晶振
高可靠性,緊密穩(wěn)定性.
FMXMC3S2120FFC-20.000000M-CM,5032mm,FMXMC3S2系列,FMI貼片晶體 參數(shù)表
Parameter | Specification | |||||||||||||||||||
Frequency Range | 20.00 MHz | |||||||||||||||||||
Operation Mode | See Operation Mode and ESR Table | |||||||||||||||||||
Load Capacitance (CL) | 18 pF Std., 6 - 60 pF and Series available | |||||||||||||||||||
Frequency Tolerance | ±30 ppm @ 25°C Std. (See Cal. Tol. for Options) | |||||||||||||||||||
Temperature Tolerance | ±50 ppm Std.(See Temp. Tol. for Options) | |||||||||||||||||||
Operating Temperature | 0 to +70°C Std.(See Temp. Range for Options) | |||||||||||||||||||
Storage Temperature | -40 to +85°C / -55 to +125°C | |||||||||||||||||||
Equivalent Series Resistance (ESR) | See Operation Mode and ESR Table | |||||||||||||||||||
Shunt Capacitance (C0) | 7 pF max. | |||||||||||||||||||
Drive Level | 10 µW typical, 300 µW max | |||||||||||||||||||
Aging @ 25°C | ±5 ppm per year max. | |||||||||||||||||||
Insulation Resistance | 500MΩ min. at 100VDC±15V | |||||||||||||||||||
Reflow Conditions | 260°C ±10°C for 10sec max., 2 reflows max. |
FMXMC3S2120FFC-20.000000M-CM,5032mm,FMXMC3S2系列,FMI貼片晶體 尺寸圖