蘋果手機(jī)A16芯片晶體管性能提升多少SG3225VAN愛普生LVDS差分晶振X1G004241015600

蘋果在發(fā)布會(huì)上說,A16Bionic著力于3個(gè)部分,分別是能效powerefficiency、顯示display和攝像頭camera.拋開后兩個(gè)不談,只說能效而不說性能,或許說明了A16單純?cè)谛阅苌系奶嵘⒉淮?/span>-我們此前說A15以及相同CPU微架構(gòu)的M2的CPU性能提升就不算特別大.愛普生晶振這是否表明了蘋果這兩年在芯片設(shè)計(jì)上遇到了瓶頸?當(dāng)然能效上的打磨價(jià)值也非常大,這也一直是蘋果的優(yōu)勢(shì).前不久還談過今年更早的那批所謂的4nm芯片大概率都是假4nm,而A16極有可能才是真4nm,是不是應(yīng)該有點(diǎn)滿意?

SG3225VAN愛普生晶振X1G004241015600,蘋果手機(jī)A16芯片晶體

愛普生有源晶振編碼	型號(hào)	頻率	長X寬X高	輸出波	電源電壓	工作溫度	頻差
X1G004241014800	SG3225VAN	116.713000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241014900	SG3225VAN	322.265625MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015000	SG3225VAN	133.333333MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015100	SG3225VAN	108.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015300	SG3225VAN	300.120000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015400	SG3225VAN	160.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015500	SG3225VAN	148.351648MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241015600	SG3225VAN	250.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241015800	SG3225VAN	243.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241016200	SG3225VAN	148.351648MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016300	SG3225VAN	108.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016400	SG3225VAN	148.351600MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241016500	SG3225VAN	625.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241016700	SG3225VAN	144.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241016900	SG3225VAN	415.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241017100	SG3225VAN	128.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-50ppm
X1G004241017200	SG3225VAN	128.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241017300	SG3225VAN	161.132812MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241017400	SG3225VAN	656.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018000	SG3225VAN	657.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018100	SG3225VAN	625.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-30ppm
X1G004241018400	SG3225VAN	148.350000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-40to85°C	+/-50ppm
X1G004241018500	SG3225VAN	300.000000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-20ppm
X1G004241018700	SG3225VAN	234.375000MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-30ppm
X1G004241018800	SG3225VAN	117.187500MHz	3.20x2.50x1.20mm	LVDS	2.250to3.630V	-20to70°C	+/-30ppm

蘋果A16堆了160億個(gè)晶體管——A15實(shí)則也有150億晶體管,以及這顆新的SoC芯片在顯示引擎和ISP上下了點(diǎn)工夫,那么堆料上能夠分派給CPU、GPU的余地也就不大了.石英晶振所以性能提升真的不做好.不過A16用上了臺(tái)積電的4nm工藝,比5nm先進(jìn)不是?今年蘋果iPhone14系列新品發(fā)布會(huì),談到A16芯片的部分信息算是很少；連往常都要出面談兩句AppleSilicon架構(gòu)的JohnySrouji都沒出現(xiàn),就A16芯片都沒有怎么介紹,實(shí)在是手機(jī)APSoC愛好者的不理解.